We Proudly Represent These Manufacturers | Horizon Technical Sales, Inc.

	BGA socketing systems -- two piece & one-piece sockets. Custom interposer and mezzanine solutions. Interstitial PGA sockets. Peel-A-Way® SIP, DIP, and PGA/BGA sockets. PLCC/LCC, adapters. SMD B2B connectors
	Display interface products: TV encoder, TMDS transmitter, TMDS receiver, LVDS trans- mitter, HDTV encoder, HDCP. Camera interface products: CMOS image sensor, visual communication software.
	Battery Management (chargers, charge pumps); Voltage Regulation/DC-DC Conversion (buck, boost and PWM regulators, P-channel MOSFETs, high-side switches); Interface and Power Management (LDOs, Voltage Detectors, uP reset); Display/Lighting Products
Goldentek Display System	TN, STN, FSTN, TFT LCD panels. Character and graphic LCD modules (8-40 characters, high contrast, wide viewing angle, extended temp). Available in COB, COG, COF, and TAB packages. Backlighting solutions available
	DRAM: (4M-512M SDRAM), DDR and DDR2 (128M - 512M); Asynchronous SRAM: (low power, high speed, automotive: 64K - 16M and 1.65V-5V); Synchronous SRAM (Pipeline, Flow Thru, No-Wait); QDR/DDR SRAM (36M and 72M); EEPROM: (1K-128K Microwire, 2-wire, SPI, smart cards); Pseudo SRAM; MCPs
Macronix	Industry standard flash (MX29, 4M - 64m, 5V/3.3V); Serial flash (MX25, 512K - 128M, 2.7V - 3.6V); Masked ROMs (5V/3V, 16M - 512M, x8/x16/x32); Logic products (digital answering machine, digital voice recorder, FM transmitter, mobile audio processor)
	JEDEC Standard SIMM/DIMM/SODIMMs/miniDIMMs. Flash Disk Modules (HDD Replacement), Battery-backed SDRAM, SRAM Modules. Application Specific Embedded Modules (ASEM) based on DSP, µC, RISC, DRAM, SRAM and IDE Flash technologies.
	Connector covers (metal, metalized plastic, and plastic); ethernet hoods; D-sub connectors. EMI/RFI shielded covers (metal or metalized plastic).
Ole Wolff International	Power magnetics: inductors, chokes, line filters, tranformers. Acoustic products: miniature microphones, condensers, speakers
	Piezoceramic buzzers, transducers, alarms, sirens and ultra-thin, flat speakers
	PCB Modular Jacks (RJ11, RJ45, USB, top & side mount, ganged, shielded, unshielded, LED); Ethernet and telephone cables/assemblies, telecom accesories and premis distribution products.
	System Interconnect Technology. High bandwith Serial Rapid IO switch fabrics, for chip-to-chip and board-to-board interconnect between RapidIO end points. High performance/low power PCI, PCI-X, and PCI Express bridges for PCI local bus projects. VME system interconnect bridges. Host bridges for Power PC (Freescale/IBM) to PCI interconnect. Hypertransport bridges for Hypertransport to PCI/X applications.
	UNION TECHNOLOGY CORPORATION SMT multilayer ceramic capacitors, High voltage SMT multilayer ceramic caps, Radial leaded high voltage multilayer ceramic caps, High Frequency Switch Mode Power Supply (SMPS) capacitors in accordance with DECC spec 87106, Feed-through discoidal caps, Planar capacitor arrays.